Samsung Orders 50 Hybrid Bonding Machines for Memory Chip Line at Pyeongtaek Plant
Samsung Electronics has begun construction of a hybrid bonding mass-production line at its Pyeongtaek campus and initiated the purchase of 50 equipment units from Dutch maker Besi to fabricate next-generation high-bandwidth memory and logic chips.
The machines, priced at approximately $4.3 million each, face a delayed delivery schedule after Samsung requested architectural modifications that Besi has been reluctant to make. Samsung is also testing hybrid bonders from domestic supplier SEMES, with mass production expected to begin around 2029 or 2030.
From the sources (4 posts)
@jukan05Samsung Electronics Begins Construction of Hybrid Bonding Mass-Production Line at Pyeongtaek P5 Samsung Electronics has begun constructing a die-to-wafer (D2W) hybrid bonding mass-production line at its Pyeongtaek Campus. The line will be
@jukan05
@jukan05Interesting. Hybrid bonding is expected to be used for Feynman, which will feature custom HBM (cHBM). It appears the technology has been pushed back from conventional HBM4E.
@jukan05@BeuvingJordy "However, it will take more time to finalize the order. Samsung has requested modifications to the equipment architecture, making it difficult to determine a specific delivery date. Such modifications involve changing certain