TSMC Teams With Winbond to Supply DRAM for AI Chips

TSMC has brought memory maker Winbond into its supply chain for AI chips, a move aimed at cultivating a domestic source of memory wafers amid deepening global shortages. The two companies will collaborate on next-generation WoW, or Wafer-on-Wafer, 3D stacking technology, under which Winbond supplies DRAM wafers that TSMC stacks directly onto logic processors.

The partnership allows TSMC to diversify sourcing away from traditional suppliers including Samsung Electronics, SK Hynix and Micron. Winbond is expected to use the collaboration to enter the AI server and high-performance computing supply chains.