Nvidia Rubin Adoption Lifts HVLP4 Copper Foil Demand
Demand for HVLP4, or Hyper Very Low Profile, copper foil is expected to surge in the second quarter as Nvidia adopts the material across its Rubin platform, including compute and switch trays and midplanes, according to a media report. The same report said Amazon is using it in Trainium 3 UBB motherboards and switch trays, while Google is adopting it for TPU v7 computing boards, with shortages emerging and price increases expected.
HVLP4 is an ultra-smooth copper foil designed to reduce surface irregularities, allowing electricity to move faster with less signal loss and heat. The material is used in copper-clad laminate and is important for high-speed AI chips and connections above 100 gigabits per second.
From the sources (2 posts)
@dnystedtDemand for HVLP4 (Hyper Very Low Profile) copper foil is expected to surge starting in the 2nd quarter (now) as Nvidia adopts it across the Rubin platform (compute/switch trays, midplanes, etc.), Amazon Trainium 3 UBB (motherboard) and swit
@dnystedtHVLP4 is ultra-smooth copper foil with almost no surface bumps. This lets electricity flow faster with far less signal loss and heat — essential for high-speed AI chips and 100+ Gbps connections. It’s the upgraded version of HVLP2/HVLP3. T