TSMC Builds Panel-Level Packaging Supply Chain, Targets 2027 Mass Production for AI Chips
Taiwan Semiconductor Manufacturing Co. is building out a materials, components and equipment supply chain for panel-level packaging, with mass production targeted as early as 2027, according to South Korea’s ETNews, which cited industry sources. The technology packages chips on rectangular panels rather than round wafers, reducing wasted edge area and potentially lifting AI-chip output; a standard 600-by-600 millimeter panel can yield roughly five to six times as many chips as a mainstream 300-millimeter wafer, the report said.
The effort positions TSMC to challenge Samsung Electronics Co., which the report said moved earlier in PLP and has already used it for mobile application processors and power-management chips. TSMC is expected to run a pilot line this year before a broader ramp, adding to a wider advanced-packaging expansion after CoWoS shortages pushed overflow orders to ASE and Powertech and left a supply-demand gap that a separate media report said could narrow to 10% by the end of 2026 from about 20% now.
From the sources (4 posts)
@dnystedtTSMC is expanding CoWoS advanced packaging capacity so fast it could narrow the supply-demand gap to just 10% by end-2026, from 20% now, media report, noting TSMC and suppliers are working hard to deploy new capacity and further improvement
@dnystedtTSMC’s inability to meet CoWoS demand has sent overflow orders to packaging specialists ASE, Powertech, media report, adding ASE raised its 2026 capex to US$8.5 billion from $7 billion to meet demand for Leading Edge Advanced Packaging (LEA
@jukan05TSMC Preparing for Full-Scale Mass Production of "Panel-Level Packaging (PLP)" Semiconductors TSMC is set to go head-to-head with Samsung Electronics using "panel-level packaging (PLP)," a next-generation semiconductor packaging technology
@jukan05Breaking: TSMC is building out its materials, components, and equipment supply chain for CoPoS, targeting mass production next year, according to South Korea’s ETNews.