TSMC Discloses Glass-Substrate Validation With Ibiden, Innolux for AI Chip Packaging
Taiwan Semiconductor Manufacturing Co. is working with Ibiden Co. and Innolux Corp. to validate glass substrates for next-generation AI chip packaging, according to DigiTimes, which cited equipment-side sources. TSMC has shared a glass-substrate development program for CoWoS with suppliers, and joint validation showed a 16% improvement in its package-warpage indicator, a 19% reduction in effective thermal expansion and a 31% increase in effective modulus, marking the company’s first public disclosure of joint glass-substrate results with the two partners.
The effort comes as AI demand strains CoWoS capacity and TSMC builds a broader chip-on-panel-on-substrate, or CoPoS, ecosystem to compete more directly with Intel and Samsung Electronics. Separate industry-source reports said TSMC aims to begin panel-level packaging mass production as early as next year; rectangular panels can yield roughly five to six times as many chips as a standard 300-millimeter wafer, though glass-substrate commercialization remains farther off because through-glass via processing and long-term reliability still need more validation.
From the sources (6 posts)
@dnystedtTSMC is expanding CoWoS advanced packaging capacity so fast it could narrow the supply-demand gap to just 10% by end-2026, from 20% now, media report, noting TSMC and suppliers are working hard to deploy new capacity and further improvement
@dnystedtTSMC’s inability to meet CoWoS demand has sent overflow orders to packaging specialists ASE, Powertech, media report, adding ASE raised its 2026 capex to US$8.5 billion from $7 billion to meet demand for Leading Edge Advanced Packaging (LEA
@jukan05TSMC Preparing for Full-Scale Mass Production of "Panel-Level Packaging (PLP)" Semiconductors TSMC is set to go head-to-head with Samsung Electronics using "panel-level packaging (PLP)," a next-generation semiconductor packaging technology
@jukan05Breaking: TSMC is building out its materials, components, and equipment supply chain for CoPoS, targeting mass production next year, according to South Korea’s ETNews.
@jukan05Sources: TSMC Working with Ibiden and Innolux on CoPoS Glass Substrate Development Project- Digitimes
@jukan05TSMC Teams Up with Ibiden and Innolux to Push CoPoS — Reportedly Flooring the Accelerator in Glass Substrates To meet robust AI chip demand, TSMC is not only ramping CoWoS advanced packaging capacity but has, for the first time, disclosed