TSMC Targets 4Q28–1Q29 Mass Production of Glass Core Substrates for AI Chips

TSMC is targeting 4Q28–1Q29 for mass production of a glass core substrate used in advanced AI-chip packaging, according to industry checks described in an analysis of a leaked slide from a June 11 presentation at Japan's JPCA Show 2026. The analysis said the timing would align with Nvidia's AI-chip iteration cadence and that TSMC is developing the technology with Ibiden and Innolux.

The material was described as critical for addressing warpage and durability constraints in AI packaging while improving power delivery, which could raise packaging yields, cut losses and enable more AI compute. The same analysis said the substrate could cost several times more than existing ABF substrates, but that substrate cost is only a low single-digit share of an AI chip's bill of materials, while packaging-yield losses run roughly five to 10 times that amount; Nvidia and two US-based customers were described as interested.