ASML, TSMC, imec Demonstrate 2D-Material Transistors on 300 mm Wafers at 50 nm Pitch

techsciencephysics 3 posts · 3 accounts

ASML, TSMC and imec said they achieved 300 mm integration of 2D-material transistors with a 50 nm pitch, describing the work as a demonstration of 2D TMD transistors at scale on 300 mm wafers.

The milestone was presented as progress toward complementary post-silicon logic devices, with the 50nm poly-pitch result moving 2D-material transistors closer to broader semiconductor use.

From the sources (3 posts)

@dnystedt

RT @lithos_graphein: imec, TSMC, and ASML have achieved a major first — demonstrating 2D TMD transistors at scale on 300mm wafers. Using EU…

@newmaxxssd

(PR) ASML, TSMC, and imec Achieve 300 mm Integration of 2D-Material Transistors with 50 nm Pitch Direct:

@vaibhavparulkar

imec, TSMC, and ASML scaled 2D-material transistors to 50nm poly pitch on 300mm wafers, bringing complementary post-silicon logic devices closer to reality. Advanced material science is the ultimate physical boundary. #SiliconSovereignty So

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