Nvidia’s First Rubin Chips Seen Shipping to Assembly Partners in July-August as TSMC Targets Q3 Mass Production
Nvidia’s first big batch of Rubin chips is expected to complete final packaging in July and August and begin shipping to system assembly partners, according to a media report citing unnamed supply-chain sources. The report said Taiwan Semiconductor Manufacturing Co. began making the initial batch in late March to early April, increased monthly wafer starts to 40,000 to 50,000 in the second quarter and expects to reach mass production in the third quarter. It added that the cycle from wafer start to a final CoWoS package is about four months.
The timing provides a clearer production milestone for Rubin after an earlier report said Foxconn had won orders across Nvidia’s three major AI server platforms: Vera Rubin NVL72, HGX Rubin NVL8 and MGX modular servers. Those orders were expected to lift Foxconn revenue in the second half of 2026, tying the supplier’s outlook to Nvidia’s ability to move Rubin from early chip output into broader server assembly.
From the sources (3 posts)
@dnystedtFoxconn has won orders across all three major Nvidia AI server platforms, which are expected to cause 2nd half-2026 revenue to surge, media report, particularly as Morgan Stanley estimates the build-of-materials for Vera Rubin servers (VR20
@dnystedtNvidia’s first big batch of Rubin chips will finish (final packaging) in July-August and start being delivered to system assembly partners, media report, citing unnamed supply chain sources. TSMC began manufacturing the initial batch in lat
@firstadopterOh. $NVDA