AMD Pledges More Than $10 Billion to Expand Taiwan AI Chip and Packaging Capacity
AMD has pledged to invest more than $10 billion across Taiwan’s ecosystem to scale advanced packaging and accelerate next-generation AI, adding a concrete spending commitment after Chief Executive Officer Lisa Su traveled to Taipei ahead of the Computex trade show to meet suppliers. Su was expected to meet Taiwan Semiconductor Manufacturing Co. Chief Executive Officer C.C. Wei as AMD sought additional 2-nanometer and advanced-packaging capacity for anticipated GPU and CPU demand.
The investment targets Taiwan’s chip industry and advanced chip packaging for AI as AMD expands partnerships and begins making its next-generation Venice chips.
From the sources (7 posts)
@dnystedtAMD CEO Lisa Su arrived in Taipei on Wednesday (May 20) ahead of the Computex Taipei trade show – and ahead of Nvidia CEO Jensen Huang, media note – to begin meeting with suppliers. Su will reportedly meet with TSMC CEO C.C. Wei to secure m
@businessAMD pledges to invest more than $10 billion in Taiwan
@stocksavvyshay$AMD announced a $10B+ investment across $TSM ecosystem to scale advanced packaging for next-gen AI infrastructure. Venice EPYC is ramping on TSMC 2nm while Helios with MI450X GPUs is targeting multi-gigawatt deployments beginning in 2H 20
@aaronwei3nRT @AMD: Today, we announced more than $10B in investment across Taiwan’s ecosystem to scale advanced packaging and accelerate next-gen AI…
@ftr_investors$AMD AMD plans to invest more than $10B in Taiwan’s AI ecosystem, partnering with ASE and SPIL to develop more power-efficient AI chips and strengthen its manufacturing capabilities in the region 🤖 🇹🇼
@cnbcAMD to invest $10 billion in Taiwan's AI industry to advance top-end chips
@techmemeAMD pledges to invest $10B+ in Taiwan's chip industry to expand partnerships and advanced chip packaging for AI, and begins making its next-gen Venice chips (@qinsherry / Wall Street Journal) (Visit Techmeme dot com for the link and full c