TSMC Capacity Crunch Pushes Chip Clients Toward Intel and Samsung
TSMC's advanced manufacturing lines and CoWoS chip-packaging capacity are fully booked, according to media reports, creating shortages that are pushing some customers to seek production from Intel or Samsung. The reports said TSMC shares fell NT$55 on Monday to close at NT$2,235, and that more than NT$1 trillion of market value has been erased since reports surfaced that Apple and other customers were talking with Intel.
The latest report follows an earlier account that Tesla planned to move the TSMC portion of its next-generation AI6 chip program to Intel Foundry, after AI6 had previously been expected to be split between TSMC and Samsung. Taken together, the reports suggest tight capacity at TSMC is leading some customers to consider rival foundries for advanced chip production.
From the sources (3 posts)
@jukan05Interesting. Tesla’s current AI5 chip, codenamed Helios, is reportedly being foundried by TSMC and Samsung, and the next-generation AI6 was also originally expected to be split between those two foundries. However, under strong pressure a
@andrewcurran_RT @jukan05: Interesting. Tesla’s current AI5 chip, codenamed Helios, is reportedly being foundried by TSMC and Samsung, and the next-gene…
@dnystedtTSMC’s advanced manufacturing processes and CoWoS advanced packaging are completely full, a ‘sweet problem’ causing real trouble for the chip giant as reports grow of clients turning to Intel or Samsung because they cannot get enough TSMC c