TSMC Raises Photonic Chip Capacity to 10,000 Wafers a Month, 78 Million Chips a Year
TSMC is expanding monthly wafer processing for photonic integrated circuits to 10,000 units in the second quarter, up from 500 wafers, according to media reports. This ramp increases annualized chip output to 78 million units, compared with 4 million previously.
The expansion targets co-packaged optics, a technology that uses light signals to bypass the physical limits of electrical data transfer. TSMC projects capacity will reach 15,000 wafers per month by the fourth quarter and at least 25,000 by 2028. The figures are based on institutional investor estimates that assume 648 dies per wafer.
From the sources (2 posts)
@dnystedtTSMC production of Photonic Integrated Circuits (PIC), the key light chip in co-packaged optics (CPO), is ramping hard. Media reports note monthly capacity is climbing to 10,000 wafers-per-month (wpm) as of Q2, up from 500wpm earlier—boosti
@mojotricksTSMC boosts PIC capacity to power CPO mass production #TSMC