TSMC Plans Arizona Advanced Chip Packaging Plant by 2029
businesstech 2 posts · 2 accounts
TSMC plans to open an advanced chip packaging plant in Arizona by 2029, Reuters reported, citing Senior Vice President Kevin Zhang. Zhang said construction has begun on the project.
From the sources (2 posts)
@dnystedtRT @StockMKTNewz: Taiwan Semiconductor $TSM announced today plans to open a chip packaging plant in Arizona 🇺🇸 by 2029 - Reuters https://t.…
@techmemeTSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun (Reuters) (Visit Techmeme dot com for the link and full context!)