TSMC Plans Arizona Chip Packaging Plant by 2029
Taiwan Semiconductor, or TSMC, plans to open an advanced chip packaging plant in Arizona by 2029, according to Reuters. Senior Vice President Kevin Zhang said construction has begun.
From the sources (5 posts)
@stockmktnewzRT @StockMKTNewz: Taiwan Semiconductor $TSM announced today plans to open a chip packaging plant in Arizona 🇺🇸 by 2029 - Reuters https://t.…
@dnystedtRT @StockMKTNewz: Taiwan Semiconductor $TSM announced today plans to open a chip packaging plant in Arizona 🇺🇸 by 2029 - Reuters https://t.…
@polymarketmoney$TSM said it plans to open a chip packaging plant in Arizona by 2029.
@techmemeTSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun (Reuters) (Visit Techmeme dot com for the link and full context!)
@taiwannewsenTSMC plans chip packaging plant in Arizona by 2029